Failure analyses in order to clarify the failure cause soonest possible.
From single device to the whole system - and from highly complex IC up to printed circuit board (PCB), mounting & interconnection technology and printed board assembly (PBA).

• functional check on devices, printed board assemblies (PBAs), modules and systems
• verification of functionality
• circuit analysis
• failure simulation and reproduction
• optoelectronic and vehicle specific measurements

• Focused Ion Beam (FIB)
• X-ray and scanning acoustic microscopy
• light optical and scanning electron microscopy
• chemical and mechanical decapsulation
• failure localisation with emission microscopy and liquid cristall thermography
• reverse processing (wet and dry etching)
• metallographic cross-sectioning
• mounting- and material analysis
• solder joint assessment
• risk analysis and recommendation of corrective actions