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Dear Reader,
Welcome to our first Failure Analysis newsletter in 2018! This newsletter will keep you informed of the latest news, updates and developments.
We hope you enjoy reading this newsletter.
Best regards,
Your RoodMicrotec FA team
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New chemistry laboratory
RoodMicrotec opens its new state-of-the-art laboratory in Stuttgart
To meet the increasing demand for failure analysis of plastic encapsulated components, RoodMicrotec has expanded its laboratory capabilities by opening a new chemistry laboratory. The failure analysis of plastic encapsulated components involves opening the components with fumic acids. In the process vapours emerge, which cannot be captured and completely removed by the fume hood. To avoid the risk of corrosion influence on other equipment, RoodMicrotec opened another chemistry laboratory. The capacity for decapsulation of components was increased by the new lab, including additional chemical fume hoods.  
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Anamnesis in Failure Analysis
Jürgen Gruber presenting at the MicroTec Südwest Cluster Conference
Jürgen Gruber, Manager Failure & Technology Analysis at RoodMicrotec, gave a presentation at the MicroTec Südwest Cluster Conference for new applications with microsystems technology. His presentation focused on failure analysis going towards anamnesis. Due to miniaturization and complexity of electronic circuits, the interaction between the components increases significantly. Due to the advancement in the production process of the components itself, the board assembly and the ambient conditions in the application have a large influence on the long-term reliability. As a consequence, in most cases, the component is a victim and not the root cause of the failure. Therefore, anamnesis, a holisitc approach is a good tool for successful root cause detection. The presentation and discussion was well received by the professional audience. The feedback was overwhelmingly positive and a lot of new contacts were made. With this in mind, a road map for failure analysis is being developed. This map will be presented in the next newsletter.
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Case of the month
One of our front runners in failure analysis are Printed Circuit Boards (PCB). In our case of the month, the customer reported open connections at PCB level. Metallographic cross sections showed barrel cracking in the via metallization. The crack area also showed a lower thickness of the copper layer. The round shape of the void area was a clear indication for an etching attack. Our anamnesis of the process flow revealed a poor cleaning process during PCB manufacturing. Remaining process chemicals caused an etching process of the copper metallization. Thermal load during the board assembly/soldering process caused the crack formation in the thinned layer.
 
Via in printed circuit board Barrel cracking
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RoodMicrotec at DLR Conference
Dr. Björn Hoffmann presented its know-how on NDT
Mid April, Dr. Björn Hoffmann,Team Leader Materials Analysis & Innovation at RoodMicrotec, delivered a presentation at the DLR (Deutsches Zentrum für Luft- und Raumfahrt) Conference for space components. Dr. Hoffmann addressed modern methods of Non-Destructive Testing (NDT) of single components, assemblies and complete systems by using scanning acoustic microscopy and X-ray computed tomography. There is a growing need for such NDT methods, since systems get smaller, more complex, and the rarity and cost for some special components makes it harder to sacrifice some of these parts to destructive testing. The talk gained great feedback, as many modern techniques have not yet found their way into the very conservative HiRel market, Additionally, RoodMicrotec was represented at the conference by Senior Director of Sales Jan de Koning Gans and COO Reinhard Pusch. As one of RoodMicrotec's key markets, HiRel/aerospace industry is always one of our main focuses.
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Welcoming new Optoelectronics colleagues
As a result of the high demand the Optoelectronics department further strengthen its team
Since March 1st our Optoelectronics team is strenghtened by two new young and motivated engineers. Dr. Jonas Marquard who did hid doctorate at the Nobel Prize laureate Professor Stefan Hell's group in Heidelberg, and Martin Gollhofer who recently submitted his doctorate thesis at the Institute of Semiconductor Engineering in Stuttgart, will from now on push the advancement of our qualification work on optoelectronic devices. In additon to conducting failure analysis tasks on LEDs, VCSEL and other optical components, they will take advantage of their scientific background to intensify our participation as an active partner in federal funded projects.
From the left: Martin Gollhofer and Dr. Jonas Marquard
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EMPA Seminar
The EMPA Akademie is organizing s seminar with the title "ESD-Risiken an automatisierten Prozessanlagen - Einschätzung und Behebung" on June 14th 2018 in Dübendorf, Switzerland. Members of RoodMicrotec's Failure Analysis Pool get CHF 70,- discount on the seminar.
If you are interested please refer to the attached flyer for more information.
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Update of upcoming event
Visit RoodMicrotec at Sensor + Test 2018
Sensor + Test takes place from 26.06 - 28.06.2018 in Nuremberg!
Take this great opportunity to visit us at the shared exhibition stand: Strategische Partnerschaft Sensorik e.V. in Hall 1, Booth 1-324 + 1-429.
Please come along and see how we can address your individual needs with our broad range of services. Our experts will be at hand to help with advice and will guide you through how our experience and knowledge can help resolve even the most complex problems.
If you would like to prearrange a personal one-to-one meeting, please email Dieter.Schreiber@roodmicrotec.com.
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